Samsung Electronics became the first company in the world to begin mass production and shipment of sixth-generation high bandwidth memory (HBM4) chips in February 2026 [1, 2]. Four months into the product's market release, sales revenue for Samsung’s HBM4 chips has exceeded $1 billion, according to industry sources reporting on June 23, 2026 [1, 2, 3].
The HBM4 chips are designed specifically for next-generation AI accelerators, including Nvidia’s Vera Rubin platform, aiming to meet growing demand for advanced memory in AI computing [2]. Industry analysts expect Samsung’s HBM4 sales revenue to surpass $1.2 billion by the end of June 2026 [1, 2].
Looking ahead, Samsung is projected to sharply increase shipments during the second half of 2026. Industry sources say the company’s annual sales of HBM4 chips could exceed $10 billion in their first full year on the market [2].
The global high bandwidth memory market itself is forecast to grow rapidly this year, with an estimated size of $54.6 billion in 2026—up 58% from 2025 [2]. This growth illustrates strong market demand for HBM technology as AI and high-performance computing applications expand.
Samsung’s sales milestone four months post-launch highlights its early lead in HBM4 chip production. The company plans to build on this momentum with increased volume shipments in the months ahead. Monitoring quarterly results later this year will show whether those sales projections hold true.
